Major Responsibilities:
1) Responsible for driving new product/project engagement from new/existing customer
2) Responsible for all techncial communication to customer as contact window in assigned products from business development,design,NPI,production
3) Responsible for bridging between company  & customer to completed problem solving in sales business operation
4) Responsible for avhieve sale revenue goal cowork with BU/RnD/Factory
5) Responsible for support specific tasks assigned by Dept. supervisor

Travel Required: Domestic 25%  &  International 5%

Requirements:
1.Education: BS at least in ME or EE ; MS is preferred  ; PMP certification is preferred        
2.Experience:
--At least 8 years experience in technical related field of semiconductor packaging domain (CABGA/ fcCSP/ PoP/ WLP/ SiP),especially in either new product introduction & package R&D ,or customer quality engineering with experience on direct communicating with customers as technical/quality interface;
--Package design & package level/board level reliability knowledge is a plus as preference
3.Special Skills or Qualifications:  
Good project management skill, good package assembly process technology understanding,good package design know-how,clear logical thinking ability,independent problem solving ability,can-do attitude with aggressive willingness to take challenges,trackable excellence work under high pressure,open to self-learning,good personality & honest,good communication skill and communication channel management,English communication(CET6),team work player.