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Qualcomm中國(guó)

Project Management Manager

收藏職位
  • 我要分享
  • 30萬(wàn)-50萬(wàn)/年
  • 無(wú)錫
  • |
  • 10年以上
  • |
  • 本科
  • |
  • 全職

職位誘惑: 技術(shù)領(lǐng)先,股票期權(quán),福利好,五險(xiǎn)一金,年終獎(jiǎng)金

發(fā)布時(shí)間: 2020-04-08發(fā)布

職位描述

GENERAL SUMMARY:
 
QC is searching for a highly motivated, task oriented manager with a broad knowledge of engineering principles in a fast-changing technical environment. Candidate must have a solid foundation in project management and supervising and in technologies and processes of SIP (System in Package).
           
The responsibilities of this role include:
 
·         Intense driving of projects to meet goals in stipulated time
·         Strong controlling capabilities to achieve project progress
·         Motivation of team members to develop their potential
·         Thoroughness in following up shortcomings and encountered problems
 
 
PRINCIPAL DUTIES AND RESPONSIBILITIES:
 

  • Supervision and driving of project schedules and success to meet goals in stipulated time
  • Strong controlling capabilities to achieve project progress/ Identifies shortcomings in project management and implements appropriate countermeasures (short and long term).
  • Thoroughness in following up shortcomings and encountered problems
  • Motivation of team members to develop their potential
·         Trains and enhances project management skills of project lead engineers.
  • Ensures active participation of team members in project.
  • Ensures that check for design on manufacturability and quality is performed together with Operations and Quality.
  • Makes efficient usage of manpower resources to benefit the project
  • Requests support from management whenever required; highlights critical shortcomings to management
 
 
 
 
 
 
REQUIRED COMPETENCIES:
(All competencies below are required upon entry)
 
·         Strong statistical and analytical knowledge, skilled in FMEA, DOE, Minitab, DMAIC
·         Good background and knowledge in SIP packaging methods
  • Good knowledge in Module Assembly Processes (SMT, Molding, Lasermarking, Dicing)
  • Green or Blackbelt
  • Basic knowledge in RF technology such as filter technology and RF devices testing technology.
  • Assertiveness, poise and ability to work with different teams
·         Failure Analysis knowledge such as SEM, de-cap, lapping, CSAM, X-ray, …
·         Excellent MS Office skills required
  • Assertiveness, poise and ability to work with different teams
·         Analytical Skills - The ability to collect information and identify fundamental patterns/trends in data. This includes the ability to gather, integrate, and interpret information from several sources.
·         Building Trusting Relationships - The ability to build trusting, collaborative relationships and rapport with different types of people and businesses. This includes delivering on commitments and maintaining confidential information, as well as being approachable, showing interest in the other person, and relating well to people regardless of personality or background.
  • Communication - The ability to convey information clearly and accurately, as well as choosing the most effective method of delivery (e.g., email, phone, face-to-face). This includes using a technically sound communication style both verbally and in writing.
  • Creating the New and Different - The ability to be creative. This includes the ability to produce breakthrough ideas, being a visionary, managing innovation, seeing multiple futures, having broad interests and knowledge, and gaining support in order to translate new ideas into solutions. This also includes the ability to plan and implement unconventional ideas and speculate about alternative futures without all of the data.
·         Decision Making - The ability to make quick, accurate decisions. This includes the ability to weigh alternatives and take into account the impact of the decisions on people, equipment, or other resources.
·         Documentation -The ability to appropriately document software and/or hardware specifications and processes to promote knowledge transfer to other engineers.
  • Getting Work Done - The ability to be organized, resourceful, and planful. This includes the ability to leverage multiple resources to get things done and lay out tasks in sufficient detail. This also includes the ability to get things done with fewer resources and in less time, work on multiple tasks at once without losing track, and foresee and plan around obstacles.
·         Mentoring and Coaching - The ability to develop, coach, and mentor associates. This includes the ability to provide development experiences and network opportunities, advise, and teach to prepare associates for effective job performance.
·         Project Management - The ability to use organizational skills for purposes of planning and decision-making. This includes developing and communicating objectives, timelines, assignments, and goals. This also includes the ability to scope projects, orchestrate multiple activities at once, and use resources efficiently across functional areas within the enterprise.
 
 
 
 
 
MINIMUM QUALIFICATIONS: (not-editable)
 
·         Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
·         7+ years Hardware Engineering experience or related work experience.
 
 
PREFERRED QUALIFICATIONS: (not-editable)
 
·         Master's Degree in Engineering, Information Systems, Computer Science or related field.
·         12+ years Hardware Engineering experience or related work experience.
·         3+ years experience with circuit design (e.g., digital, analog, RF).
·         3+ years experience utilizing schematic capture and circuit simulation software.
·         3+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc.
·         1+ years in a technical leadership role with or without direct reports.
 

職位發(fā)布者

Emily Ge

HR

7天

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