BG&Dicing Principle PE
- 20萬-30萬/年
- 北京
- |
- 5年以上
- |
- 本科
- |
- 全職
職位誘惑: 五險一金,年底雙薪,成長空間大,技術(shù)領(lǐng)先,技能培訓(xùn),免費班車
發(fā)布時間: 2018-12-05發(fā)布
職位描述
1、Responsible for the process development of 8 or 12 inches wafer of BG&Tape&Dicing process;
2、Responsible for prepare related documents used on BG&Tape&Dicing equipment process buyoff and material evaluation;
3、Responsible for BG&Tape&Dicing process related technology transfer work, and solve problems in technology transfer wafer bond, confirmation, ensure product yield and cycle time reach the established target;
4、Responsible for make BG&Tape&Dicing and assistant process work instruction;
5、Responsible for optimizing and maintenance BG&Tape&Dicing and assistant process stabilization;
6、Responsible for wafer bonder and assistant equipment parameter monitor, and create preventive flow about out of spec limit issue;
7、Responsible for evaluation 2nd resource,include: material、tools、Jig、 etc.;
8、Organizing meetings and making decisions on abnormal status;
9、Make of NG and low yield products related disposal mothed and documents;
10、Responsible for training of new process engineers.
1、負責(zé)8寸、12寸晶圓BG&Tape&Dicing及相關(guān)工藝的開發(fā);
2、負責(zé)BG&Tape&Dicing及相關(guān)工藝、材料的評估;
3、負責(zé)優(yōu)化BG&Tape&Dicing及相關(guān)工藝流程,并制定相關(guān)作業(yè)指導(dǎo)書;
4、負責(zé)BG&Tape&Dicing及相關(guān)工藝的量產(chǎn)化及工藝的維護和優(yōu)化;
5、負責(zé)BG&Tape&Dicing及相關(guān)工藝技術(shù)轉(zhuǎn)移,解決BG&Tape&Dicing及相關(guān)工藝轉(zhuǎn)移過程中出現(xiàn)的問題,使產(chǎn)品良率和cycle time達到既定目標;
6、負責(zé)BG&Tape&Dicing及相關(guān)工藝測試參數(shù),對超出spec的產(chǎn)品做異常處理及預(yù)防;
7、負責(zé)BG&Tape&Dicing及相關(guān)工藝新耗材及2nd source耗材評估;
8、決策受BG&Tape&Dicing及相關(guān)工藝影響的產(chǎn)品能否release;
9、制定BG&Tape&Dicing及相關(guān)工藝不合格產(chǎn)品報廢;
10、負責(zé)訓(xùn)練新進工程師
任職要求:
1、More than 5 year’s experiences of process engineer in FAB or packaging line;
2、Experience in process supporting to BG&Tape&Dicing(Disco\Nitto), and have high-level off-site training;
3、Strong hands-on and communication skills;
4、Knowledge of SPC\DOE\FMEA and so on;
5、Skilled use of MS、 analysis software;
6、Have an outstanding of English ability;
7、Have a sense of innovation and team work.
1、5年以上半導(dǎo)體FAB、或封裝線設(shè)備工藝工程師工作經(jīng)驗;
2、對Disco\Nitto等設(shè)備有實際工作經(jīng)驗,并接受過高等級的場外培訓(xùn);
3、有SPC\DOE\FMEA\8D等知識;
4、具有探索創(chuàng)新意識,工作積極主動;
5、能熟練應(yīng)用Word、Excel、PPT等辦公軟件;
6、英文能力突出;
7、工作認真細致,有創(chuàng)新意識,有團隊精神。
職位發(fā)布者
鄭小姐
HR
簡歷處理用時
簡歷及時處理率
賽萊克斯微系統(tǒng)科技(北京)有限公司
領(lǐng)域: 軍工航天,消費電子
規(guī)模: 200-500人
主頁: http://www.silexmicrosystems.com
工作地址:
北京經(jīng)濟技術(shù)開發(fā)區(qū)經(jīng)海5路1號院42號樓偉鑫大廈503
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