1、Responsible for Dry Etch related process (RIE Poly-Si, Al, SiO,SiN and DRIE Si) set up, fine tune, optimization and related yield enhancement；
2、Fully grasp the Dry Etch process, take the initiative to solve all the process issues, reduce wafer scrap rate;
3、Actively participate in continuous improvement plan, reduce product defect density and improve the Cp/Cpk performance;
4、Evaluate new equipment to fully release, develop new process to mass production；
5、Responsible for process innovation, including writing patents, completing equipment and process experiment reports；
6、Analyze process issues for R & D or mass production, and hunt for reasonable solutions；
7、Conscientiously implement quality management norms, improve product yield and reduce production costs；
8、Organize the process training for new employee.
1、負責干法刻蝕全部相關(guān)工藝的調(diào)試、優(yōu)化及良率提升直至順利量產(chǎn)；
2、充分掌握生產(chǎn)線上的工藝情況，主動執(zhí)行解決已經(jīng)或可能出現(xiàn)的問題，處理設(shè)備和產(chǎn)品的異常問題，維護工藝的穩(wěn)定性，降低產(chǎn)品報廢率；
3、積極參與各項持續(xù)改善活動，執(zhí)行改善措施來提高設(shè)備生產(chǎn)效率、降低產(chǎn)品缺陷密度、改善工藝的Cp/Cpk；
4、評估新設(shè)備，并具備開發(fā)新工藝的能力，順利實現(xiàn)新產(chǎn)品導入和量產(chǎn)；
5、統(tǒng)籌安排設(shè)備的安裝、工藝調(diào)試、驗收以及設(shè)備維護；
6、負責組織實施工藝/技術(shù)創(chuàng)新（包括撰寫專利）、完成設(shè)備工藝實驗報告和工藝問題技術(shù)報告；
7、分析研發(fā)和生產(chǎn)過程中出現(xiàn)的各類技術(shù)問題并提出合理的解決方案；
8、詳細記錄產(chǎn)品的工藝參數(shù)，對其缺陷進行統(tǒng)計分析，建立相應(yīng)的數(shù)據(jù)庫；
9、認真執(zhí)行質(zhì)量管理規(guī)范，提出改善器件工藝，提高產(chǎn)品良率，降低生產(chǎn)成本的措施；
10、及時調(diào)查品質(zhì)異常的根本原因，制定好預(yù)防再發(fā)生的長期監(jiān)控及現(xiàn)場處置方法，形成文件并上報；
11、安排和組織員工的工藝技術(shù)培訓；
12、負責與其他工藝模塊進行對接、高效解決工藝開發(fā)過程中的各類問題。

任職要求：
1、At least 5 years experiences in process development or maintenance for Dry Etch, familiar with related process and measurement equipment operation and recipe editing；
2、Familiar with the structure and working principle of the Dry Etch platform, and can independently modify, create, verify, and optimize the process recipes；
3、Knowledges in semiconductor, microelectronics, and material science；
4、Strong hands-on, analytical, innovative and communication skills；
5、Proficient in office software such as Word, Excel, PPT, etc., can output summaries, reports, other documents skillfully；
6、Fluent English speaking and writing skill；
7、Experience in process development and equipment management in 8-12 inch Fab is preferred;
8、Not limited on above mentioned.
1、5年以上半導體FAB刻蝕（RIE, O2 Asher, DRIE等）工藝開發(fā)與維護工作經(jīng)驗；熟悉Poly-Si, SiN, SiO等的干法刻蝕工藝；
2、對刻蝕（Dry Etch）設(shè)備的結(jié)構(gòu)&工作原理熟悉，對工藝菜單的創(chuàng)建、驗證、優(yōu)化和修改均可獨立完成；
3、了解設(shè)備的真空、和射頻等離子體系統(tǒng)的工作原理；
4、較強的動手能力、分析能力、創(chuàng)新能力和溝通協(xié)調(diào)能力；
5、能熟練應(yīng)用Word、Excel、PPT等辦公軟件；具有一定的寫作能力，能熟練輸出工作總結(jié)、匯報、案例等文檔；