Chip lead
- 40萬(wàn)-60萬(wàn)/年
- 上海
- |
- 10年以上
- |
- 碩士
- |
- 全職
職位誘惑: 年終獎(jiǎng)金,五險(xiǎn)一金,十五薪,年度旅游,技術(shù)領(lǐng)先,通訊津貼,交通補(bǔ)助,節(jié)日禮物,技能培訓(xùn)
發(fā)布時(shí)間: 2019-11-13發(fā)布
職位描述
Product Definition:
- Able to bridge the abstract, semi completed concepts into concrete design solutions
- Assist the Senior Architect in developing and verifying relevant product(s)
- Define the detailed technical product specification
- Define product V&V strategy
- Work with DfT architect/TPE to define DFT concept and test strategy
Product Development: - Hands on technical design and development of BMS IC chip, lead the various disciplines
- Design and develop analog mixed signal circuits, guide layout, modelling and for BMS Chip, meeting the specifications, adhering to the planning, contributing to all aspects with respect to functionality, characteristics and structure and in line with the BMS product roadmap.
- Verify upfront using AMS V&V (or otherwise) and other design methods the quality of products before MRA. Validate on bench and sign-off functionality of the products in line with agreed specification.
- Bridge IC development to Industrial activities, identify the gaps and oversee the industrial impact of his/her/team’s design choices
- Take ownership and develop expertise in defined areas of expertise required for BMS in general
- Support (peer) for AMS V&V , Validation and Test development teams
- Solve silicon issues by contributing to debug or 8D teams
- Drives development and implements Functional Safety architecture
Expert role: - Act as screening expert in the department
- Represent department in high power user groups
Learning and sharing: - Pro-actively make knowledge available for operational use within the development team through thorough documentation, such as to contribute to successful sharing of knowledge, analysis and traceability.
- Attend technical conferences, study new techniques and reach out to peers , share knowledge in technical meetings, webinars
Experience· At least 10 years of relevant IC design experience in the semiconductors industry Experience in the automotive sector is preferred but not limiting
· Understands the Automotive mind-set
Education· MSc/ME (special case BSc) in Electrical/Electronics Engineering
· Experience of relevant CAD tools (Cadence flow) and IC design methodology
· Fluent in English
Behaviour and soft skills· Be focused and result oriented
· Clear and structured approach in resolving and closing technical challenges
· Able to cluster challenges within various product development domains, provide technical leadership to the team
· Independently upgrade and adapt your leadership, competence and skills while on the job
· Take personal ownership, don’t wait for someone else
· Show an engaged curiosity, a will to understand the mechanisms behind the effects, an eagerness to constantly learn and improve
· Be enthusiastic, have fun in what you do
· Conscious of interpersonal differences, able to handle multi-cultural, multi-site teams
· Clear and concise communication – straight to the point
職位發(fā)布者
datang nxp
HR
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大唐恩智浦半導(dǎo)體有限公司
領(lǐng)域: 汽車電子
規(guī)模: 50-100人
主頁(yè): http://www.datangnxp.com/index.aspx
工作地址:
上海市普陀區(qū)曹楊路
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