- 26萬-50萬/年
- 上海
- |
- 5年以上
- |
- 本科
- |
- 全職
職位誘惑: 年終獎金,股票期權,天天下午茶,年度旅游,交通補助,技能培訓
發(fā)布時間: 2020-02-11發(fā)布
職位描述
Responsibilities：
1. Responsible for the design physical implementation from netlist to GDS tape out, including:
2. Chip/Block floorplan;
3. CTS, Power plan, Placement & Routing, SPF extraction;
4. DRC/LVS, and GDS tape out.
Requirements:
1. 2-5 years of experience and minimum of BS in EE or equivalent; MS a plus. Experienced in one of the major P&R (Place & Route) tool suites (Cadence, Synopsys);
2. Background in timing closure and signoff (PrimeTime experience);
3. Scripting expertise (Perl, Tcl, or Python) a strong plus;
4. Actual chip tapeout experience on a recent technology node (40nm or below) a strong plus.
更多地平線愿景可戳Bloomberg Markets: China Open 采訪：https://mp.weixin.qq.com/s/4DtSP1rfqByShkuPQ0o_-g
職位發(fā)布者
李莉萍
HR
7天
簡歷處理用時
100%
滬公網安備31011502017136號