-Work with both fab and internal teams to handle product yield& reliability issues and strive for continuous improvement.
與晶圓廠及內(nèi)部團(tuán)隊(duì)合作，處理產(chǎn)品良率與可靠性相關(guān)問(wèn)題并持續(xù)改進(jìn)。
-Support design enables in product development phase, including problem solving for circuitry simulation, device operation, reliability assurance, layout, tape out, etc.
在產(chǎn)品開發(fā)階段支持設(shè)計(jì)實(shí)現(xiàn)，包括解決電路仿真、器件使用、可靠性、版圖、設(shè)計(jì)定案等方面的問(wèn)題。
-Track emerging technologies, like MRAM/RRAM, for AI and big data applications.
跟蹤人工智能與大數(shù)據(jù)相關(guān)新興技術(shù)，包括磁阻式隨機(jī)存取存儲(chǔ)器/阻變存儲(chǔ)器等。