職位描述:
·      驅(qū)動項目的規(guī)劃和實施。
·      促進項目范圍、目標和可交付成果的定義
·      計劃和安排項目時間表，使用適當?shù)墓ぞ吒欗椖拷桓冻晒?br />·      協(xié)調(diào)跨職能團隊，包括ASIC、SW、HW等。
·      持續(xù)監(jiān)控項目進展并向項目關(guān)系人報告，包含項目進度、問題，風險和解決方案。
·      實施和管理項目變更和干預(yù)措施，以實現(xiàn)項目產(chǎn)出
·         進行項目評估和結(jié)果評估
 
任職資格:
·      碩士學(xué)歷，至少3年工作經(jīng)驗，或?qū)W士學(xué)位至少五年相關(guān)工作經(jīng)驗
·      了解整個芯片開發(fā)生命周期和整個設(shè)計流程（晶圓加工/封裝/測試/質(zhì)量保證/軟件/電路板等）
·      項目管理資格或同等資格
·      項目管理的理論和實踐方面的知識
·      項目管理技術(shù)和工具知識
·      有獨立工作經(jīng)驗，并作為團隊的一部分解決技術(shù)、質(zhì)量、成本和進度方面的難題
·      良好的溝通與組織協(xié)調(diào)能力，主動性，責任心強.
 
Responsibilities:
·         Lead the planning and implementation of project.
·         Facilitate the definition of project scope, goals and deliverables
·         Plan and schedule project timelines, track project deliverables using appropriate tools
·         Coordinate cross-function teams include ASIC, SW, HW etc.
·         Constantly monitor and report on progress of the project to all stakeholders, present reports defining project progress, issues, risks and solutions
·         Implement and manage project changes and interventions to achieve project outputs
·         Produce Project evaluations and assessment of results
 
Requirements:
·         Master’s Degree or equivalent with a minimum of 3 years’ experience or a Bachelor’s Degree with a minimum of 5 years’ related experience.
·         Understand of complete chip development lifecycle and entire design flow. (wafer processing/packaging/testing/QA/software/board/etc.)
·         Qualification in project management or equivalent
·         Knowledge of both theoretical and practical aspects of project management
·         Knowledge of project management techniques and tools
·         Experience working independently and as part of a team to solve difficult technical, quality, cost, and schedule challenges
·         Good communication organization ability, initiative, sense of responsibility