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歐司朗光電半導(dǎo)體(中國)有限公司

(Sr.) Die Bond Engineer

收藏職位
  • 我要分享
  • 12萬-22萬/年
  • 無錫
  • |
  • 3年以上
  • |
  • 本科
  • |
  • 全職

職位誘惑: 年終獎金,五險一金,福利好,老板nice,年底雙薪,年度旅游,成長空間大,交通補助,節(jié)日禮物,技能培訓(xùn),免費班車

發(fā)布時間: 2020-07-28發(fā)布

職位描述

Job Responsible:
1. Identify problems or unfavorable process deviations and execute/implement corrective/improvement actions
2. Take the lead on customer complaint investigation and 8D responsibilities
3. Daily monitoring and dispose on abnormal/maverick lots, low yield lots.
4. To training and compile process documentation filling and update, WI, FMEA…
5. Provide sustaining engineering support to the manufacturing team through detailed failure analysis, technical support, documentation revisions, assembly support, and training support to resolve issues in a timely fashion
6. Work on continue improvement project to simplify/improve the flow/system which can reduce the system loop
holes or ease the daily task

Job Requiremnet:
1. At least 3-4 years experience on semiconductor assembly area, main focus on Die Attach process and bachelor in EE
2. Need to be able to accept changes from time to time . Must be stress tolerance as we are directly dealing with production
3. Good communication skills and team work spirit. Good English read and writing skills, oral English is also preferred
4. Excellent Microsoft office application skill

職位發(fā)布者

June Huang

HR

7天

簡歷處理用時

100%

簡歷及時處理率

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