Required knowledge, skills, abilities:
    
1. ISO9001 & IATF16949 plus VDA6.3
    
2. MSA, SPC, FMEA, APQP, PPAP
    
3. Sampling plan (MIL-STD-105E & MIL-STD-1916)
    
4. 8D methodology of problem analysis& solving (Is-Is Not, Ishikawa C&E Diagram & Verifications, 5-Way, Fault tree analysis . . . )
    
5. 6S, RoHS, ESD
    
6. Operation of chip probing, IC package assembly & final testing
    
7. 6Sigma(DMAIC) knowledge
    
8. Emotional quotient plus communication/negotiation/integration (情緒管理與溝通協(xié)調(diào)整合)
    
    
Required education and experience
    
1. College or Bachelor above. 工業(yè)工程與管理及理工相關(guān)科系
    
2. Experienced in semiconductor IC assembly process, quality control, manufacturing for 5 years.